Universal Laser Precision Processing Equipment

Project

Parameters

Product Dimensions L × W × H

1670*1450*1855mm

Usage Environment

Operates in Class 10,000 cleanrooms or better. (Upgraded unit required for non-clean environments.)

Material Dimensions

300mm, 2-inch, 4-inch, 6-inch, 8-inch, and 10-inch

Material Thickness

10um～5mm

Surface Structure

Flat, circular, frosted, or other shapes;

Laser wavelength

1064/532/355/266nm or other band ultrafast lasers

Scan Method

Large-area scanning, localized scanning, 2/3/4/5 axis linkage

Average Power

0.1W～200W@1Hz～500KHz

Platform-compatible sheet size

<2000*1500mm

Etching line width

< 2 0 μm (uniformity ±5 μm)

Machining accuracy

1um to 30um, varies

Positioning Accuracy / Repeatability

±3～15μm

Etching speed

≤400mm/scc

Machining Materials

Hard metal, wafers, silicon wafers, carbon fiber, diamond tool bits, coated films, etc.